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‘Software’ specially designed for the test, ‘development’ or ‘production’ of Printed Circuit Boards (PCBs).
Authority: EUProhibited Supply To: IRProgram: IR‘Software’ specially designed for the test, ‘development’ or ‘production’ of Printed Circuit Boards (PCBs).
Authority: EUProhibited Supply To: IRProgram: IRChemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 3919 90 80Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 3919 90 80Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 3919 10 80Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 3919 10 80Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRProgram: IRCode: 7410 21Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRProgram: IRCode: 7410 21Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRProgram: IRCode: 7410 11Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRProgram: IRCode: 7410 11Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRKPBYRUProgram: IRCode: 3824 99 96Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRKPBYRUProgram: IRCode: 3824 99 96Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRProgram: IRCode: 2833 40Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRProgram: IRCode: 2833 40Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRProgram: IRCode: 2827 39 85Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRProgram: IRCode: 2827 39 85Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRProgram: IRCode: 2827 39 20Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRProgram: IRCode: 2827 39 20Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
High priorityAuthority: EUProhibited Supply To: IRBYRUProgram: IRCode: 8534 00Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
High priorityAuthority: EUProhibited Supply To: IRBYRUProgram: IRCode: 8534 00Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 3921 90 55Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 3921 90 55Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 9031 80 80Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 9031 80 80Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 9031 80 20Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 9031 80 20Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 9031 49 90Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 9031 49 90Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 9031 49 10Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 9031 49 10Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRProgram: IRCode: 9030 89Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRProgram: IRCode: 9030 89Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRProgram: IRCode: 9030 84Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRProgram: IRCode: 9030 84Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 9030 39 00Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 9030 39 00Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 9030 33 70Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 9030 33 70Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 9030 33 20Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EUProhibited Supply To: IRBYRUProgram: IRCode: 9030 33 20