Search Sanctioned Goods & HS Codes

10K+ items found

Radio frequency systems and equipment not included in Regulation (EU) 2021/821, components and accessories, specially designed or modified to develop any of the following functions: a. Take control and command of UAVs. b. Deliberately and selectively interfere with, deny, inhibit, degrade or deceive radio frequency signals for the control and command of unmanned aircraft. c. Use the specific features of the radio frequency protocol used by drones to interfere with their operation.
Authority: EU
Prohibited Supply To: IR
Program: IR
Code: 8517 71
Radio frequency systems and equipment not included in Regulation (EU) 2021/821, components and accessories, specially designed or modified to develop any of the following functions: a. Take control and command of UAVs. b. Deliberately and selectively interfere with, deny, inhibit, degrade or deceive radio frequency signals for the control and command of unmanned aircraft. c. Use the specific features of the radio frequency protocol used by drones to interfere with their operation.
Authority: EU
Prohibited Supply To: IR
Program: IR
Code: 8517 71
Radio frequency systems and equipment not included in Regulation (EU) 2021/821, components and accessories, specially designed or modified to develop any of the following functions: a. Take control and command of UAVs. b. Deliberately and selectively interfere with, deny, inhibit, degrade or deceive radio frequency signals for the control and command of unmanned aircraft. c. Use the specific features of the radio frequency protocol used by drones to interfere with their operation.
High priority
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 8517 62
Radio frequency systems and equipment not included in Regulation (EU) 2021/821, components and accessories, specially designed or modified to develop any of the following functions: a. Take control and command of UAVs. b. Deliberately and selectively interfere with, deny, inhibit, degrade or deceive radio frequency signals for the control and command of unmanned aircraft. c. Use the specific features of the radio frequency protocol used by drones to interfere with their operation.
High priority
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 8517 62
‘Software’ specially designed for the test, ‘development’ or ‘production’ of Printed Circuit Boards (PCBs).
Authority: EU
Prohibited Supply To: IR
Program: IR
‘Software’ specially designed for the test, ‘development’ or ‘production’ of Printed Circuit Boards (PCBs).
Authority: EU
Prohibited Supply To: IR
Program: IR
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 3919 90 80
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 3919 90 80
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 3919 10 80
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 3919 10 80
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IR
Program: IR
Code: 7410 21
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IR
Program: IR
Code: 7410 21
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IR
Program: IR
Code: 7410 11
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IR
Program: IR
Code: 7410 11
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IRKPBYRU
Program: IR
Code: 3824 99 96
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IRKPBYRU
Program: IR
Code: 3824 99 96
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IR
Program: IR
Code: 2833 40
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IR
Program: IR
Code: 2833 40
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IR
Program: IR
Code: 2827 39 85
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IR
Program: IR
Code: 2827 39 85
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IR
Program: IR
Code: 2827 39 20
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IR
Program: IR
Code: 2827 39 20
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
High priority
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 8534 00
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
High priority
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 8534 00
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 3921 90 55
Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 3921 90 55
Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 9031 80 80
Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 9031 80 80
Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 9031 80 20
Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 9031 80 20
Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 9031 49 90
Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 9031 49 90
Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 9031 49 10
Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 9031 49 10
Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EU
Prohibited Supply To: IR
Program: IR
Code: 9030 89
Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EU
Prohibited Supply To: IR
Program: IR
Code: 9030 89
Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EU
Prohibited Supply To: IR
Program: IR
Code: 9030 84
Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EU
Prohibited Supply To: IR
Program: IR
Code: 9030 84
Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 9030 39 00
Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).
Authority: EU
Prohibited Supply To: IRBYRU
Program: IR
Code: 9030 39 00

Search sanctioned goods across UK and EU export control lists in one place. This tool covers dual-use items, military equipment, and other restricted goods and technologies. Each entry includes the specific goods description, issuing authority, countries subject to import or export restrictions, and the relevant sanctions programme. This helps compliance and trade teams determine whether an item is subject to import or export prohibitions.

Use the filters to narrow results by authority, target state, or sanctions programme. Whether you’re checking a single HS code or reviewing an entire category, the sanctioned goods list is updated as new designations and programme consolidated changes are published.

Goods search

Search results

‘Software’ specially designed for the test, ‘development’ or ‘production’ of Printed Circuit Boards (PCBs).

‘Software’ specially designed for the test, ‘development’ or ‘production’ of Printed Circuit Boards (PCBs).

Filters

Search results

‘Software’ specially designed for the test, ‘development’ or ‘production’ of Printed Circuit Boards (PCBs).

‘Software’ specially designed for the test, ‘development’ or ‘production’ of Printed Circuit Boards (PCBs).