Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).

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• Equipment, including tools, dies, fixtures or gauges, and other specially designed components and accessories therefor, specially designed or modified for any of the following: a. For the manufacture or inspection of: 1. Free electron ‘laser’ magnet wigglers; 2. Free electron ‘laser’ photo injectors
• Equipment, including tools, dies, fixtures or gauges, and other specially designed components and accessories therefor, specially designed or modified for any of the following: For the adjustment, to required tolerances, of the longitudinal magnetic field of free electron ‘lasers’.
• Dimensional inspection or measuring systems or equipment not controlled by 2B006 or 2B206, as follows: Manual dimensional inspection machines, having both of the following characteristics: a.1. Two or more axes; and a.2. A measurement uncertainty equal to or less (better) than (3 + L/300) micrometer in any axes (L measured length in mm).
• Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).