Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).

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ANNEX VII - List of goods and technology referred to in Articles 2a(1) and 2b(1)

Electronics

EU Regulation 833/2014

Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).