Code

EU Code

Category

Subcategory

Prohibited Supply To

Authority

Document

Notes

• Electronic test equipment, other than those specified in the CML or in Regulation (EU) 2021/821
• Telecommunications test equipment, other than those specified in the CML or in Regulation (EU) 2021/821.
• Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).

Goods

• Radar systems, equipment and major components, other than those specified in the CML or in Regulation (EU) 2021/821, and specially designed components therefor, as follows: a. Airborne radar equipment, other than those specified in the CML or in Regulation (EU) 2021/821, and specially designed components therefor; b. ‘Space-qualified’‘laser’ radar or Light Detection and Ranging (LIDAR) equipment specially designed for surveying or for meteorological observation; c. Millimeter wave enhanced vision radar imaging systems specially designed for rotary wing aircraft and having all of the following: 1. Operates at a frequency of 94 GHz; 2. An average output power of less than 20 mW; 3. Radar beam width of 1 degree; and 4. Operating range equal to or greater than 1 500 m
• Oscilloscopes, spectrum analysers and other instruments and apparatus for measuring or checking electrical quantities (excluding meters of heading 9028 ); instruments and apparatus for measuring or detecting alpha, beta, gamma, x-ray, cosmic or other ionising radiations
• Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).