Copper foil (whether or not printed or backed with paper, paperboard, plastics or similar backing materials) of a thickness (excluding any backing) not exceeding 0,15 mm; backed

Copper foil (whether or not printed or backed with paper, paperboard, plastics or similar backing materials) of a thickness (excluding any backing) not exceeding 0,15  mm

Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a.  PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b.  Multilayer PCB substrates, containing at least one layer of any of the following materials: 1.  Aluminium; 2.  Polytetrafluoroethylene (PTFE); or 3.  Ceramic materials (e.g. alumina, titanium oxide, etc.); c.  Etchant chemicals; 1.  Ferric chloride (7705-08-0); 2.  Cupric chloride (7447-39-4); 3.  Ammonium persulphate (7727-54-0); 4.  Sodium persulphate (7775-27-1); or 5.  Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d.  Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e.  Polymeric substances and films thereof of less than 0,5  mm of thickness, as follows: 1.  Aromatic polyimides; 2.  Parylenes; 3.  Benzocyclobutenes (BCBs); or 4.  Polybenzoxazoles.

Copper foil (whether or not printed or backed with paper, paperboard, plastics or similar backing materials) of a thickness (excluding any backing) not exceeding 0,15 mm; backed

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