Electronic items, as follows: (a) General-purpose integrated circuits, as follows: Notes: 1. The status of wafers (finished or unfinished), in which the function has been determined, is to be evaluated against the parameters of 3A001.a. 2. Integrated circuits include the following types: — ‘Monolithic integrated circuits’; — ‘Hybrid integrated circuits’; — ‘Multichip integrated circuits’; — ‘Film-type integrated circuits’, including silicon-on-sapphire integrated circuits; — ‘Optical integrated circuits’; — ‘Three-dimensional integrated circuits’; — ‘Monolithic Microwave Integrated Circuits’ (‘MMICs’).

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• ‘Detectors’ specially designed or modified to protect rocket systems and unmanned aerial vehicles against nuclear effects (e.g. Electromagnetic Pulse (EMP), X-rays, combined blast and thermal effects), and usable for the systems specified in 1.A.Technical Note:A ‘detector’ is defined as a mechanical, electrical, optical or chemical device that automatically identifies and records, or registers a stimulus such as an environmental change in pressure or temperature, an electrical or electromagnetic signal or radiation from a radioactive material. This includes devices that sense by one time operation or failure.
• “Radiation Hardened”“microcircuits” usable in protecting rocket systems and unmanned aerial vehicles against nuclear effects (e.g. Electromagnetic Pulse (EMP), X-rays, combined blast and thermal effects), and usable for the systems specified in 1.A.