Other self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls

Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB ‘composite’ substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR 6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals; 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in points 1 to 4. Note: This control does not control ‘chemical mixtures’ containing one or more of the chemicals specified in this entry in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.

Other self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls

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